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CPU COOLER ACC THERMAL PAD / 100X100X1.0 ACTPD00063A ARCTIC

Product Code: EL1464166
EAN: 4895265001253
Available at supplier's warehouse: 100 pcs
Order now and collect in store on 29 October
The delivery time is calculated from the moment the order is placed and payment is received. If the order is placed on a weekend or public holiday, the delivery time starts from the next business day.
€13.63
  • Specifications
  • Description

  • ColourGrey
  • Units per Pallet0
  • Category CodeCOA
  • Shipping Box Width29.5 cm
  • Units per Shipping Box200
  • Product Net Weight0.04 kg
  • Shipping Box Weight9.9 kg
  • Shipping Box Height16.5 cm
  • Vendor Homepagewww.arctic.de/en/TP-4/ACTPD00063A
  • Unit Box Height0.002
  • Unit Box Length0.119
  • Unit Box Width0.114
  • Shipping Box Depth29.5 cm
  • Unit Height0.2 cm
  • Unit Depth11.9 cm
  • Unit Width11.4 cm
  • Unit Calculated Volume7.18E-05 cubm
  • Unit Calculated Weight0.049 kg
  • ModelACTPD00063A

ARCTIC TP-4 100X100X1.0 Premium Performance Thermal Pad (ACTPD00063A)

High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.

Safe Application
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.

Tailored Made for SP6
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.

Water Block Design for SP6
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.

Available in Various Thicknesses and Sizes
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.

Stackable Without Performance Loss
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.

Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.

General Specifications
Operating Ambient Temperature    -40-200 °C
Dimensions    100 (L) x 100 (W) x 1 (H) mm
Thermal Pad Specifications
Hardness    50 Shore OO
Specific Gravity    3.4 g/cm³
Breakdown Voltage    8620 V/mil
Dielectric Constant    7.2 @1 MHz
Volume Resistance    1.52 x 10^13 Ω-cm
Flammability Rating    UL 94 V-0

Packaging
 Width: 115 mm
 Height: 2 mm
 Length: 120 mm
Weight: 0.045 kg

 

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